SemiAnalysis：2.5D 封装迈向 3.5D，良率成关键
SemiAnalysis 指出，随着 interposer 和 substrate 接近缩放极限，2.5D 封装正迈向 3.5D，通过更紧密的 D2D pitch、更高带宽密度和更低每 bit 能耗来突破 reticle 对横向扩展的限制。
As interposers and substrates approach their scaling limits, 2.5D packaging is moving toward 3.5D, with tighter D2D pitch, higher bandwidth density, and lower energy per bit to overcome reticle-driven constraints on lateral scaling.
Higher integration density makes yield increasingly critical to economics. Final yield compounds across process steps, so losses at any stage directly affect overall yield.
More HBM stacks, chiplets, substrates, and bonding interfaces increase integration complexity, while some defects are detected only late in the process flow. This tightens process-control requirements across the integration flow and increases the importance of advanced inspection.
来源：SemiAnalysis_ · x.com