SemiAnalysis_· @SemiAnalysis_ · X·· 1 天前精选AI 评分
SemiAnalysis 解析真武 M890 芯片
我们此前在 WAIC 2026 总结中报道过真武 M890，当时更仔细地看了这款芯片的版图。真武 M890 芯片采用 4 组 HBM3E 12-Hi，配备 2 个计算 die。(2/3)
编辑精选：SemiAnalysis 报道给出真武 V900 的显存、互连规格及计划出货时间，便于跟踪国产 AI 算力进展；三倍性能属于厂商宣称，仍需独立实测验证。
We previously covered the Zhenwu M890 during our WAIC 2026 takeaways, where we took a closer look at the chip's floorplan. The Zhenwu M890 chip features 4 stacks of HBM3E 12-Hi, with 2 compute dies. (2/3)
来源：SemiAnalysis_ · x.com