SemiAnalysis_· @SemiAnalysis_ · X·· 9 小时前AI 评分
芯片供电从正面到背面的演进
每个晶体管都需要供电。传统上，电力从芯片正面传下来：封装触点 → 较宽的上层导线 → 更细的导线/通孔 → 局部电源轨 → 晶体管。导线主要是铜，在绝缘材料中逐层构建，与信号布线并行。(1/4)🧵
Every transistor needs power. Traditionally, it comes down from the chip’s frontside: package contact → wide upper wires → finer wires/vias → local rails → transistors. The wires are largely copper, built layer by layer in insulating material alongside signal wiring. (1/4)🧵
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