SemiAnalysis_· @SemiAnalysis_ · X·· 9 小时前AI 评分
SemiAnalysis拆解Intel背面供电工艺
Intel 从前端形成 nano-TSV，完成信号布线，并将该面键合到载片上。随后翻转并减薄晶圆以露出通孔尖端，再构建背面供电金属。这些通孔为晶体管触点供电。 完整拆解：newsletter.semianalysis.com/… (4/4)
Intel forms nano-TSVs from the front, finishes signal wiring, and bonds that face to a carrier. It flips and thins the wafer to reveal the via tips, then builds backside power metal. Those vias feed power to transistor contacts.
Full teardown: newsletter.semianalysis.com/… (4/4)
来源：SemiAnalysis_ · x.com