Cerebras CEO 解释影响 AI 加速器行业的三大供应链瓶颈
Cerebras 联合创始人兼 CEO Andrew Feldman 指出影响 AI 加速器行业的三大供应链瓶颈：HBM 内存、CoWoS 封装产能以及获取台积电 3nm 制程。
Andrew Feldman, co-founder and CEO of Cerebras explains the 3 major supply-chain bottlenecks affecting much of the AI accelerator industry:
HBM memory, CoWoS packaging capacity, and access to TSMC’s 3nm manufacturing. Cerebras largely sidesteps all 3 by architectural choice.
It does not rely on HBM or CoWoS, and its current chips are manufactured on a 5nm process rather than 3nm.
In an industry where access to memory, advanced packaging, and leading-edge fabrication capacity can directly constrain shipments, that gives Cerebras a materially different supply profile from the main-street GPU systems.
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full video on The MAD Podcast with Matt Turck and Cerebras YouTube channel, (link in comment)
来源：rohanpaul_ai · x.com