SemiAnalysis：定制 HBM 可将 HBM4 控制器与 PHY 占用面积减少约 60%

R to @SemiAnalysis_: Custom HBM tackles this issue head on. First, the wide standard PHY gets replaced with a compact die-to-die link. Samsung shows that its standard HBM4 PHY occupies 8mm x 4mm, while the custom D2D interface needs just 8.5mm x 1.5mm, roughly 60% less area. The better D2D interface also delivers more bandwidth per unit of interface area and simplifies interposer routing. Second, the memory controller moves off the compute die entirely and onto the HBM base die. Together, these free up a meaningful chunk of the compute die to be handed back for compute or cache. (2/3) Source: Samsung Hot Chips 2026

来源：X：SemiAnalysis (@SemiAnalysis_) · x.lingyaoai.com